Aqueous solution for surface treatment, method for producing surface-treated alloy, and composite and method for producing the same
US11993851B2 · kind B2 · utility
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Key dates
| Filing date | Jan 23, 2019 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Jun 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/383
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An aqueous solution for surface treatment, for treating a surface of an alloy, the aqueous solution comprising: a copper compound at a copper ion concentration of 20000 ppm or more and 50000 ppm or less; a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less; and a halide ion at a concentration of 2000 ppm or more and 70000 ppm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.