Transfer of RFID inlays from a first substrate to a second substrate
US11995493B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2021 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Feb 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods are provided for transferring a remote frequency identification (RFID) inlay from a first substrate to a second substrate. An RFID inlay is secured to a first substrate with a first adhesive. The RFID inlay is brought into the vicinity of a second substrate and secured to the second substrate with a second adhesive. The RFID inlay is then dissociated from the first substrate. The RFID inlay may be dissociated from the first substrate by softening the first adhesive, such as by the application of heat or the application of a softening substance. Alternatively, the RFID inlay may be dissociated from the first substrate without softening the first adhesive, but rather by differential release, whereby a release force is applied between the two substrates, with the release force being greater than the release strength of the first adhesive, but less than the release strength of the second adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.