Electroplating process for connectorizing superconducting cables
US11996212B2 · kind B2 · utility
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4References
16Claims
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Key dates
| Filing date | Mar 21, 2022 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | May 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An example method for connectorizing a superconducting cable is described herein. The method can include depositing an oxide layer on a surface of a superconducting cable using a first electrolytic cell, electroplating a metal layer on the surface of the oxide layer of the superconducting cable using a second electrolytic cell, and soldering a connector to the metal layer coated on the surface of the superconducting cable. The oxide layer allows the metal layer to adhere to the surface of the superconducting cable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.