Package structure and manufacturing method thereof
US11996345B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2021 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Apr 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a first semiconductor die, a first insulating encapsulation, a thermal coupling structure, and a heat dissipating component thermally coupled to the first semiconductor die through the thermal coupling structure. The first semiconductor die includes an active side, a rear side, and a sidewall connected to the active side and the rear side. The first insulating encapsulation extends along the sidewall of the first semiconductor die and includes a first side substantially leveled with the active side, a second side opposite to the first side, and topographic features at the second side. The thermal coupling structure includes a metallic layer overlying and the rear side of the first semiconductor die and the topographic features of the first insulating encapsulation. A manufacturing method of a package structure is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.