Patent · US Active

Apparatus and method for detaching a die from an adhesive film

US11996385B2 · kind B2 · utility

0Cited by

4References

8Claims

0Family size

Assignee

Besi Switzerland AG · CH

Inventors

Andreas Mayr · Meitingen, DE
Manfred Dorfer · Radfeld, AT

Key dates

Filing date	Jun 24, 2019
Grant date	May 28, 2024
Priority date	—
Expiry date	Mar 8, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB65G2203/0233
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus 100 for releasing a die 150 with a vacuum platform 130 with two or more segments 140 is provided, which may be extended independently of the surface of the vacuum platform 130 to push against the adhesive film 110 at the respective attachment in the direction of the die gripper 170. By providing two or more segments 140 that are independently extendable, die detachment (or at least partial detachment) may be performed in parallel, and two or more dies 150 may be detached before the adhesive film 110 needs to be repositioned. Both measures may increase throughput. In addition, empty attachment positions may be omitted.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.