Method for transferring micro light-emitting diodes and transferring device
US11996495B2 · kind B2 · utility
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13Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 8, 2021 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Jan 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/85
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application provides a method for transferring micro light emitting diodes and a transferring device. The device includes: a first substrate, having at least one surface arranged with a plurality of first adhesive region for a plurality of micro light emitting diodes to adhere thereon; and a transferring substrate, having at least one surface arranged with a plurality of second adhesive regions for at least a portion of the micro light emitting diodes to adhere on and being configured to transfer the at least a portion of the micro light emitting diodes to a driving back plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.