Vacuum injection molding for optoelectronic modules
US11996505B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2019 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Mar 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.