Thermal-control system of a mesh network device and associated mesh network devices
US11997781B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Oct 8, 2020 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Jun 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09027
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This document describes a thermal-control system that may be integrated into a mesh network device and associated mesh network devices. The thermal-control system, which may include a heat sink, multiple heat spreaders, and a heat shield, is such that heat originating from IC devices populating a printed circuit board of the mesh network device may be transferred to a housing component of the mesh network device for external dissipation to maintain a desired thermal profile of the mesh network device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.