Patent · US Active

Redistribution plate

US11997789B2 · kind B2 · utility

0Cited by

1References

1Claims

0Family size

Inventors

Dominik Schmidt · Palo Alto, US
Prasanna Rao Chitturi · Pleasanton, US
Jed Hsu · Fremont, US

Key dates

Filing date	Oct 24, 2022
Grant date	May 28, 2024
Priority date	—
Expiry date	Oct 24, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/162
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.