Systems and methods providing high-density memory arrangements with high-speed interconnects in a condensed form factor
US11997792B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2022 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Feb 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high-density memory system includes at least one memory-dense compute unit with a printed circuit board (“PCB”) having a half-width one rack unit (“1U”) form factor, more than 20 memory module slots arranged depth-wise from a front to a rear of the PCB with a horizontal orientation that is parallel to the half-width 1U form factor, at least one processor positioned in between the memory module slots, a dripless connector with a first port that receives a cooling solution from a manifold of a cooling unit and a second port that returns the cooling solution into the manifold, tubing that extends the full length of the PCB from the first port past the memory module slots and the at least one processor and back to the second port, and cooling blocks that are located in between the memory module slots and that are connected to the tubing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.