Cover for sealing a power module
US11997812B2 · kind B2 · utility
2Cited by
20References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2022 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Oct 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cover is disclosed, including: a first gasket that is placed along a portion of the cover that is to join with a heat sink; a second gasket that is placed around a cutout region of the cover, wherein the cover is configured to couple to a circuit board associated with the power module and expose a component on the circuit board through the cutout region; and a fastener that is configured to engage with the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.