Patent · US Active

Array substrate and manufacturing method thereof

US11997878B2 · kind B2 · utility

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9Claims
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Assignee

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Key dates

Filing dateSep 8, 2020
Grant dateMay 28, 2024
Priority date
Expiry dateJun 19, 2042

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10K59/123

Abstract

An array substrate and a manufacturing method thereof are provided. The array substrate includes a substrate and a first recess. The first recess sequentially extends through a second dielectric layer, a third insulating layer, a first dielectric layer, a second insulating layer, a first insulating layer, an active layer, and a portion of a barrier layer. A bottom surface of the first recess is formed inside the barrier layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.