Display substrate, fabricating method thereof and display panel
US11997891B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2020 |
| Grant date | May 28, 2024 |
| Priority date | — |
| Expiry date | Mar 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/3026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is display substrate, including driving circuit board, and first electrode layer, insulating layer, second electrode layer, isolation layer, transparent conductive layer sequentially stacked thereon. Driving circuit board includes pixel and bonding regions. First electrode layer includes first sub-portion in bonding region and second sub-portion in pixel region. Insulating and isolation layers are partially cover bonding and pixel regions. Insulating layer has first via hole in area corresponding to first sub-portion. Isolation layer has second via hole in the area. Axes of first and second via holes coincide, first sub-portion is exposed at first and second via holes. Second electrode layer is in pixel region, coupled to second sub-portion through third via hole in area corresponding to second sub-portion. Isolation layer has fourth via hole in area corresponding to second electrode layer. Transparent conductive layer is in pixel region, coupled to second electrode layer through fourth via hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.