Thermal conductive layer for transducer face temperature reduction
US11998397B2 · kind B2 · utility
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1References
18Claims
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Key dates
| Filing date | Feb 9, 2023 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Feb 9, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B2201/76
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method and apparatus are disclosed herein for a thermally conductive layer for transducer face temperature reduction in an ultrasound transducer assembly. In one embodiment, the ultrasound transducer assembly comprises: a transducer layer configured to emit ultrasound energy; one or more matching layers overlaying the transducer layer; a thermally conductive layer overlaying the one or more matching layers; and a lens overlaying the thermally conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.