Use of a deformable interface for the fabrication of complex parts
US11998985B2 · kind B2 · utility
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5References
10Claims
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Key dates
| Filing date | May 13, 2022 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | May 13, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/945
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An assembly for densification under load along at least one direction of compression. The assembly includes: at least one volume to be densified having a powdery and/or porous composition and having variations in thickness along the direction of compression; and at least one counter-form of a powdery and/or porous composition, having at least one face facing at least one portion of the volume. The face and each of the portions are separated by at least one deformable interface layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.