Laser cutting system
US11999014B2 · kind B2 · utility
0Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2020 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Oct 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0207
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system may include an emitting device and a controller. The emitting device may be adapted to emit a first laser beam and a second laser beam. The controller may include one or more processors and may be operably coupled to the emitting device to control emission of the first and second laser beams. The controller may be adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.