Patent · US Active

Dielectric copolymer materials

US11999893B2 · kind B2 · utility

0Cited by

9References

16Claims

0Family size

Assignee

Merck Patent GmbH · DE

Inventors

Gregor Larbig · Gelnhausen, DE
Pawel Miskiewicz · Southampton, GB

Key dates

Filing date	Oct 15, 2019
Grant date	Jun 4, 2024
Priority date	—
Expiry date	May 18, 2040

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09K2219/00
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

A polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties, and excellent mechanical properties. The polymerizable mixture can be used in a method for forming copolymers and the copolymers can be used in an electronic device as dielectric material. The copolymers can also be used in a manufacturing method for preparing a packaged microelectronic structure and microelectronic devices comprising the packaged microelectronic structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.