Systems and methods for reducing vibration of apparatuses
US12000455B2 · kind B2 · utility
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13References
20Claims
0Family size
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Key dates
| Filing date | Mar 10, 2022 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Mar 10, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16F2222/08
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.