Substrate for sensing, a method of fabricating the substrate, and analyzing apparatus including the substrate
US12000735B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Aug 19, 2021 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Dec 23, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0104
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A substrate for sensing, a method of manufacturing the substrate, and an analyzing apparatus including the substrate are provided. The substrate for sensing includes: a support layer; a plurality of metal nanoparticle clusters arranged on the support layer; and a plurality of perforations arranged among the plurality of metal nanoparticle clusters. The plurality of metal nanoparticle clusters each comprise a plurality of metal nanoparticles stacked in a three-dimensional structure. Each of the plurality of perforations transmits incident light therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.