Secure enclave system-in-package
US12001363B2 · kind B2 · utility
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18Claims
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Assignee
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Key dates
| Filing date | May 21, 2021 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | May 21, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F21/87
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A Secure Enclave SiP (SE-SiP) is disclosed. The SE-SiP provides all the security benefits of a system designed using a Trusted Platform Module (TPM), replaces the need to trust a general-purpose CPU chip vendor with the need to trust a much simpler more trustworthy configurable device, and replaces the need to trust the entire system motherboard manufacturer with the much more limited need to trust the SE-SiP manufacturer. It can provide privacy for the software and data sent to the system, resident on it, or retrieved from it, with respect to all parties—including the person/party in physical possession of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.