Application package splitting and reassembly method and apparatus, and application package running method and apparatus
US12001824B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Dec 3, 2019 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Sep 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L9/3236
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An application package splitting and reassembly method includes splitting a first application package into a main package and at least one sub-package; storing the main package and the at least one sub-package in a first file; and generating a second application package corresponding to the application, where the second application package includes a header and the first file. After receiving an original application package, a server automatically performs splitting and reassembly on the original application package to generate a complete new application package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.