Processing device and processing method for solid structure
US12002677B2 · kind B2 · utility
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21Claims
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Key dates
| Filing date | May 12, 2022 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Aug 26, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A processing device and a processing method for a solid structure are used to perform a processing procedure on the solid structure. The processing device for the solid structure of the invention provides energy to the solid structure by various electromagnetic radiation sources to cause the solid structure to generate qualitative changes or defects, that is, to form a modified layer. Stress and/or hardness of the modified layer are/is different from that of other non-processed areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.