Wafer pod transfer assembly

US12002699B2 · kind B2 · utility

Assignee

• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

• Chih-Wei Chou · Hsinchu, TW
• Sheng Lin · San Jose, US
• Yuan-Hsin Chi · Hsinchu, TW
• Yin-Tun Chou · Hsinchu, TW
• Hung-Chih Wang · Hsinchu, TW
• Yu Liu · Hsinchu, TW

Key dates

• Filing date: Mar 6, 2023
• Grant date: Jun 4, 2024
• Expiry date: Mar 6, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6773
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.