Structure for improved mechanical, electrical, and/or thermal performance having solder bumps with different lengths
US12002741B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2021 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Jun 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In some aspects, the disclosure is directed a module for improving mechanical, electrical, or thermal performance. In some embodiments, the module includes a bottom surface, a side surface, a first solder bump disposed on the bottom surface, and a second solder bump disposed on the bottom surface. In some embodiments, the bottom surface extends in a first lateral direction and a second lateral direction perpendicular to the first lateral direction. In some embodiments, the side surface extends in a vertical direction perpendicular to the first lateral direction and the second lateral direction. In some embodiments, the second solder bump is adjacent to the side surface. In some embodiments, the first solder bump has a first length in the first lateral direction. In some embodiments, the second solder bump has a second length in the first lateral direction. In some embodiments, the first length is greater than the second length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.