Film package and display device including film package
US12002744B2 · kind B2 · utility
0Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2021 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Oct 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A film package includes a base substrate having a bottom surface that includes a first portion and a second portion that are spaced apart from each other. First pad wires are disposed on the first portion of the bottom surface of the base substrate. Second pad wires are disposed on the second portion of the bottom surface of the base substrate. A light blocking member is disposed between the first pad wires and the second pad wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.