LED device and light emitting apparatus including the same

US12002797B2 · kind B2 · utility

Assignee

• QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD · CN

Inventors

• Junpeng SHI · Xiamen, CN
• Chen-ke HSU · Xiamen, CN
• Chang-Chin Yu · Zhubei City, TW
• Yanqiu LIAO · Fujian, CN
• Zhenduan Lin · Xiamen, CN
• Zhaowu HUANG · Fujian, CN
• Senpeng HUANG · Xiamen, CN

Key dates

• Filing date: Sep 16, 2022
• Grant date: Jun 4, 2024
• Expiry date: Sep 16, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0362
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A LED device includes multiple LED chips each including opposite first and second surfaces, a side surface, and an electrode assembly disposed on the second surface and including first and second electrodes. The first surface of each of the LED chips is a light exit surface. The LED device further includes an electric circuit layer assembly disposed on the second surfaces of the LED chips and having opposite first and second surfaces and a side surface. The first surface is electrically connected to the first and second electrodes. The LED device further includes an encapsulating layer enclosing the LED chips and the electric circuit layer assembly to expose the second surface of the electric circuit layer assembly.