Backplane and glass-based circuit board
US12002916B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 8, 2022 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Sep 8, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2054
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line comprises a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion comprises a plurality of connection sub-portions, each of the connection sub-portions comprise at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.