Multi-layer metallization for multi-channel emitter array
US12003076B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2020 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Mar 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S2301/176
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for fabricating an array of emitters may include providing a first metallization layer for a first set of emitters of a first channel, wherein the first metallization layer comprises a first interchannel portion positioned between the first set of emitters and a second set of emitters of a second channel. The method may include depositing a dielectric layer on the first interchannel portion of the first metallization layer. The method may include providing a second metallization layer for the second set of emitters, wherein the second metallization layer comprises a second interchannel portion positioned between the first set of emitters and the second set of emitters, and wherein the second interchannel portion of the second metallization layer at least partially overlaps the first interchannel portion of the first metallization layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.