Transversely-excited film bulk acoustic resonator with low thermal impedance
US12003226B2 · kind B2 · utility
0Cited by
62References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2021 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Aug 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/023
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on a diaphragm of the plate that is formed over a cavity in the substrate. The piezoelectric plate and the BOX layer are removed from a least a portion of the surface area of the substrate to provide lower thermal resistance between the IDT and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.