Thermal component and electronic device
US12004320B2 · kind B2 · utility
1Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2020 |
| Grant date | Jun 4, 2024 |
| Priority date | — |
| Expiry date | Nov 7, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thermal system includes a system component, a working medium, a second-level thermal component, and a working medium transmission component. The system component includes a first-level thermal component and a working medium driver. The working medium driver is configured to drive the working medium to flow through a primary flow-through structure, a secondary flow-through structure, and a transmission channel in the working medium transmission component, and the thickness of the working medium driver is less than or equal to 5 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.