Laser bonding apparatus and method
US12005520B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2021 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Jul 17, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed are laser bonding apparatuses and methods, The laser bonding apparatus comprises a stage configured to receive a substrate, a laser device that may be disposed on the stage and is configured to irradiate a laser beam onto the substrate, a first rotation support disposed outside of the stage and is configured to drivee the laser device to rotate in an azimuthal angle direction, and a second rotation support configured to support the laser device and configured to drive the laser device to rotate in a polar angle direction intersecting the azimuthal angle direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.