Gas flow systems for an additive manufacturing machine
US12005637B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2018 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Aug 28, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2201/11
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An additive manufacturing machine (900) includes a plurality of subsystems, such as a condensate evacuation subsystem (940) for removing byproducts of the additive manufacturing products near a powder bed, a closed loop subsystem (960) for cleaning contaminants from sensitive machine components (964), and/or an electronics cooling subsystem (984) for cooling an electronics compartment (980). Each subsystem (940, 960, 984) may include a dedicated gas circulation loop (942, 966, 986) that is operably coupled to a gas circulation device (944, 968, 988) for urging a clean flow of gas (946, 962, 990) to each of the subsystems (940, 960, 984) to perform a particular function.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.