Adhesive composition for semiconductor circuit connection and adhesive film containing the same
US12006308B2 · kind B2 · utility
0Cited by
2References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 22, 2019 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Mar 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/29
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.