Latex composition for dip molding, dip-molded product comprising same, and method for manufacturing dip-molded product by using same
US12006390B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Aug 12, 2020 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Oct 23, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/2296
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a latex composition for dip molding, and such latex composition includes: a carboxylic acid-modified nitrile-based copolymer latex; and a reactive compound having three or more branched chains and a reactive group at a terminal of each of the branched chains, wherein the reactive group is one or more selected from the group consisting of an amine group, a hydroxy group, an epoxy group, a glycidyl group, and an isocyanate group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.