Packaging structure of flexible sensing strip for monitoring large deformation at deep position of sliding mass and monitoring method
US12007230B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2021 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Oct 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1432
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A measurement unit module includes a printed circuit board (PCB) and electronic components being mounted on a front face of the PCB, a plurality of measurement unit modules are arranged at intervals in an extending direction of a stripped flat cable, the stripped flat cable is electrically connected to back faces of the plurality of PCBs in sequence to form a measurement unit cluster, the measurement unit cluster is packaged and molded by an extrusion technology of silica gel to form the flexible sensing strip, and the flexible sensing strip can be wound into a sensing strip reel. The packaging structure has the beneficial effects that connection integrity between the measurement unit modules is enhanced, connection strength is improved, and reliability of a flexible clinometer is improved. The flexible sensing strip can be wound into the sensing strip reel so as to be convenient to carry and convey.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.