Direct-ink-writing method for printing strain gauge array circuit
US12007231B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2022 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Mar 1, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L1/2287
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A novel direct-ink-writing (DIW) method for printing a strain gauge array circuit is disclosed. Firstly, the whole circuit is layered by a 3D printing method; a thin layer of insulating material is printed on the first circuit layer, instead of printing an insulating bridge, to form the second insulating layer; a part needing to contact the second insulating layer is not printed, but one through hole is reserved; the second circuit layer is then printed; the functional layer of the strain gauge is finally covered; the electrodes on the functional layer can contact the second circuit layer or can contact the first circuit layer through the through holes, which ensures that the functional layer contacts the two circuit layers, and also ensures the insulation in a cross part of a matrix circuit; the printing of the array strain gauge is effectively completed; and the stability of measurement is ensured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.