Photonic integrated circuit system and method of fabrication
US12007603B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2023 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Mar 1, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12173
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.