Silicon photonics optical transceiver device
US12007612B2 · kind B2 · utility
1Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2022 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Jan 30, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4292
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A silicon photonics optical transceiver device includes a silicon photonics optical module and a heat conducting housing that accommodates the silicon photonic optical module therein. The heat conducting housing has an inner surface formed with a first heat dissipation portion that wraps around and is in contact with transmitter optical sub-assemblies of the silicon photonics optical module to realize thermal conduction, and a second heat dissipation portion that is in contact with a digital signal processor of the silicon photonics optical module to realize thermal conduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.