Floating heat spreader for processing assembly
US12007818B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | May 6, 2020 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Feb 22, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05D1/227
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An example automated driving system computer can include a board, one or more processors coupled to the board, a first layer of a first thermal interface material applied on the one or more processors, a heat spreader having a first side and a second side, the first side in contact with the first layer of the first thermal interface material, a second layer of a second thermal interface material applied on the second side of the heat spreader, and a cold plate in contact with the second layer of the second thermal interface material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.