Semiconductor apparatus including cooler for cooling semiconductor element
US12009279B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Mar 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54486
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus, including an insulated substrate having a first surface and a second surface that are opposite to each other, a semiconductor element that is mounted on the first surface of the insulated substrate, and a cooler for cooling the semiconductor element. The cooler includes a heat dissipation board having a bonding surface and a heat dissipation surface that are opposite to each other, the bonding surface being bonded to the second surface of the insulated substrate, a plurality of fins provided on the heat dissipation surface of the heat dissipation board, and a cooling case having a recess accommodating the plurality of fins, an inner wall surface of the cooling case being in the recess. The heat dissipation surface is provided with a plurality of engagement pieces that position the cooling case by engaging portions of the inner wall surface of the cooling case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.