Patent · US Active

Fabric die to fabric die interconnect for modularized integrated circuit devices

US12009298B2 · kind B2 · utility

1Cited by

3References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Chee Hak Teh · Kampung Bukit Kechil, MY
Chee Seng Leong · Air Itam, MY
Lai Guan Tang · Bayan Lepas, MY
Han Wooi Lim · Bayan Lepas, MY
Hee Kong Phoon · Bagan Serai, MY

Key dates

Filing date	Apr 20, 2023
Grant date	Jun 11, 2024
Priority date	—
Expiry date	Apr 20, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15192
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.