Package system and package

US12009321B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Zhen Zhou · Shanghai, CN
• Tae Young Yang · Portland, US
• Tolga Acikalin · Chandler, US
• Johanny Escobar Pelaez · Zapopan, MX
• Kenneth P. Foust · Beaverton, US
• Chia-Pin Chiu · Tempe, US
• Renzhi Liu · Portland, US
• Cheng-Yuan Chin · San Diego, US

Key dates

• Filing date: Dec 23, 2020
• Grant date: Jun 11, 2024
• Expiry date: Oct 11, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.