Header and package with integrated cooler for electronic components

US12009634B2 · kind B2 · utility

Assignee

• Schott AG · DE

Inventors

• Andreas Krause · Frankfurt am Main, DE
• Amy Soon Li Ping · Singapore, SG
• Ong Wai Li · Johor Bahru, MY
• Karsten Droegemüller · Eichenau, DE
• Artit Aowudomsuk · Bangkok, TH

Key dates

• Filing date: Mar 3, 2021
• Grant date: Jun 11, 2024
• Expiry date: Dec 11, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10287
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A header for an electronic component including a base body, a thermoelectric cooler, a carrier and first and second conductor track arrangements. The thermoelectric cooler is thermally attached to the base body. The carrier is coupled to the thermoelectric cooler and is cooled thereby. The first and second conductor track arrangements each have a signal conductor, at least one grounding conductor and an end. The second conductor track arrangement is on the carrier and connected to the electronic component. The first and second conductor track arrangements are separated by a gap that is bridged by bonding wire connections electrically connecting the first and second signal conductors and electrically connecting the two grounding conductors, the ends facing each other across the gap, at least one of the ends having a capacitive structural feature that increases the capacitance of the first and/or the second conductor track arrangement.