Device, electronic apparatus, and wiring connection method
US12010791B2 · kind B2 · utility
0Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2020 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | May 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device includes an elastic base, a device body provided on the base, a wiring line provided on the base, a coupling member coupled to the wiring line, and an electrically conductive adhesive layer provided between the wiring line and the coupling member. The wiring line extends from the electrically conductive adhesive layer to the device body. The wiring line has a wiring portion overlapping with the electrically conductive adhesive layer. The degree of polymerization of the electrically conductive adhesive layer decreases in the extending direction of the wiring portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.