Flexible interconnect circuits and methods of fabrication thereof
US12010792B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2023 |
| Grant date | Jun 11, 2024 |
| Priority date | — |
| Expiry date | Jul 12, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09027
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.