Filtered feedthrough assembly for use in implantable medical device and method of manufacturing the same
US12011605B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 21, 2022 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Dec 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a filtered feedthrough assembly for use with an implantable medical device. The method may include gold brazing an insulator to a flange at first braze joint, and gold brazing a plurality of feedthrough wire to the insulator at second braze joints. The method may further include applying a first non-conductive epoxy to the first braze joint, and applying a second non-conductive epoxy to the second braze joint. The method may further include grit blasting a face of the flange, applying a conductive epoxy to the face of the flange, and attaching an EMI filter to the conductive epoxy such that it is grounded to the flange via the conductive epoxy and not via the first braze joint or the second braze joints.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.