Fiber composites comprising a circuit, and method therefor
US12011854B2 · kind B2 · utility
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1References
10Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 25, 2021 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Oct 8, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/34
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Fiber-composite parts that incorporate a very thin electrical circuit, and a method for making the parts via compression molding, are disclosed. The electrical circuit is encapsulated by a film having a melting point that exceeds the maximum temperature to which the film is exposed during compression molding. The electrical circuit is disposed in a composite ply, in a lay-up of composite plies, and electrical leads are routed through the composite plies so that the lead are accessible in the molded fiber-composite part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.