Secondary object integration options for 3D electrophotography based additive manufacturing
US12011875B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 8, 2022 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Mar 8, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y40/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An additive manufacturing system and method for including non-printable secondary materials, such as wire, metal, ceramic, electronics, optical fibers, or other materials, within a printed object. A first layer of the printed object includes a recess sized to fit a non-printable secondary material. The non-printable secondary material that aligns with an upper surface of the first layer is inserted within the recess. A heater roller flattens the upper surface, including the non-printable secondary material, to form a flat, printable surface for a second layer. The second layer is then deposited over the upper surface of the first layer and the non-printable secondary material. The non-printable secondary material can be suspended in a tray that aligns with the printed object and drops below the upper surface of the printed object to facilitate printing of the second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.