Path planning method based on dynamic contour offset discretization and for spatial curved-surface printing
US12011882B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2023 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Nov 28, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2113/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A path planning method based on dynamic contour offset discretization and for spatial curved-surface printing is provided. Firstly, transversal equal slicing is carried out on a target model, and single/double contours are labeled; secondly, central slicing is carried out on the model, curvature contours are discretized, feature values of contour offsets of slice layers are calculated on the basis of a surface contour curvature of the model, and dynamic offset filling for inner contours of horizontal slices is realized; then longitudinal equal slicing is carried out on the slices, and spatial discrete points of the target model are obtained; and finally, virtual double contours are constructed for the single contours, and labeling processing for the discrete points is carried out, so that a discretized three-dimensional spatial equidistant lattice of the target model is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.