Substrate and metal laminate
US12012498B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jan 21, 2022 |
| Grant date | Jun 18, 2024 |
| Priority date | — |
| Expiry date | Jan 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/068
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate with a tetrafluoroethylene polymer and an inorganic filler, wherein the proportion of the total volume of the tetrafluoroethylene polymer and the inorganic filler to the total volume of the present substrate is at least 80 vol %, and the substrate has a rate of change in dielectric loss tangent at 10 GHz before and after 72 hours of unsaturated pressure cooker test at 120° C. under 85% RH on a 127-μm thick specimen cut out from the substrate is at most 30%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.